（Specifications)技术参数：  Model 型 号FL-V3LInspectable BoardPCB Type 基板种类Post Printing 印刷后Post Mounting 贴装后Post reflow 焊接后检查对象基板PCB Size 基板尺寸Min.50mm(L)×50mm(W)   Max.400mm(L)×420mm(W)PCB Thickness基板厚度0.3—3.0mmPCB Warpage基板扭曲度＜1﹪(diagonally)对角测量Maximum Component Height上下净高Top Side: 20mm(Optional: 40mm)  Bottom Side: 50mm基板上: 20mm(可选: 40mm)  基板下: 50mmPCB Fixing Method基板固定方式Side Clamping  外形固定Defects Detected检查项目Solder availabilityComponent misalignment,Missing component wrongsolder misalignmentOpposite polarity,component solder misalignmentexcessive solderMissing component,insufficient solder,solder bridging,insufficient solderDamaged componentexcessive solder,cold soldering,solder bridgingWrong componentopen soldering solder ball,lifted有无焊锡、焊锡偏移、元件偏移、极性、缺件、lead,opposite polarity焊锡过多、焊锡过少、元件破损、元件错装缺件、错件、偏移、少锡、连锡桥接（立碑、反白、测立）多锡、空焊、假焊、锡球、翘脚极性反Inspection Range检查个数Max.10,000components/PCB   最大10，000元件/基板Data save数据保存Hard Disc    硬盘Component library元件库检查Component classification/data base/template元件分类/元件资料库/元件模板Inspection time标准检查时间4—15ms/元件（4—15ms/component,＜150ms/FOV)Results display输出检查结果PCB ID,PCB Description,Component Description,defect Description,PCB Abbr.Diagram基板ID、基板名称、元件名称、不良名称、基板概略图Process copy制程复制Process files can be saved to flash disc or shared via LAN and usedon machines with same models.同型号机器间制程通用，通过移动存储复制或通过局域网共享Communication通信SMEMA,networked inline machine and rework sation(NG terminal)LAN consists of inline machine,rework station,offline programming station and server.通过SMEMA与上下游联机；在线机器和维修站（NG终端）联网；在线机器、维修站、离线编程式站和服务器可组成局域网。Conveying flow基板搬送流程Bypass or Return    穿过或反回Reference position基准位置PCB Transport direction: from left to right,from right to right,from left to right or from rightto left(preset before shipment)基板传送方向：左至右、右至左、左至右或右至左（出厂时选择）  （Hardware Configurations)硬件配置：  Post Printing 印刷后Post Mounting 贴装后Post reflow 焊接后Vision systemCamera  摄像头3CCD Digital cameras   3CCD数字摄像头图像系统Lighting systemFour color(R,G,B,W)programming and multi angle lighting照明系统软件可编程四色(R,G,B,W)多角度LED照明Resolution 图像分辨率20um/pixel,optional(可选)：15um/pixelFOV   视场27.2mm×20.5mm(20um/pixel),20.4mm×15.4mm(15um/pixel)Minimum inspected component0201(20um/pixel),可检测最小元件Optional:01005(15um/pixel)MechanicalXYDriving systemAC servo system plus precise ball leadscrew交流伺服系统﹢精密滚珠丝杆SystemTable驱动系统机构部分XYPositioning accuracy±8um平台定位精度Positioning speed900mm/sec定位速度Conveyor 传送方式Stepper motor driven belt conveyor   步进电机驱动的皮带传送方式Transport height 生产线高度900±20mmConveyor width adjustAutomated conveyor width adjust   自动调整轨道宽度调整Working temperature使用环境温度﹢5～﹢40℃Working humidity使用环境湿度5﹪～90﹪Air pressure气压0.4—0.6Mpa   4—6kgf/C㎡Power supply电源AC  1φ220V  ±10﹪  50—60HZ  2KWDimensions尺寸L1160×W1230×H1640mmWeight重量900kg